Resume of Mr. Ghassem Azdasht
He Study mechanical engineering in the Technical University in Berlin and Laser technique in the FH Berlin.
1986 works at the TU-Berlin in area of micro joining technique via electrical conductive adhesive and Laser micro welding as well as soldering.
1989 start to work in Fhg IZM Berlin in area laser soldering of TAB (Tape Automated Bonding) and Laser Flip chip.
FPC (fiber push connection) and Laplace (laser Placer) was Patented for these applications.
Further activities was in Chip packaging (chip scale packaging),3D Packaging and embedding technique. He has Several Patent for these Applications.
He is cofounder and CTO of PacTech (packaging technologies GmbH) in 1995.
1998 was shareholder and CEO of Smartpac.
He has over 150 international Patents and developed over 30 different machines like: Wafer E-Less Nickel plating line, Wafer dryer, wafer spin coating, Wafer cleaning, Wafer screen-printing, solder balls transfer, Solder jetting, Laser solder repair system, laser flip chip, laser vertical chip assembly, Mems soldering for Prob card industry, vacuum reflow oven for Wafer under forming acid, equipments for the solar cell technologies, Laser marker for 12 inch wafer, solder dispensing using Laser, ablation of nano particle and direct implementing on Substrate via accelerating of the nano Particles, different wafer handling system……..
Since 2017 he is active as consulter and owner of creating lab Equiptec.
His current activities are, accelerated temperature shock test in micro dimension and in mille second, optimization and increasing the laser absorption of materials via mixing of different wafe length. develop of Parallel solder jetting for PCB substrate and solder ball transfer on Wafer using 40µm solder balls and smaller